Metallife Inc. provides customized high reliable high power RF packaging solutions
that meet your needs.

RF Power T/R PKG for GaN or LDMOS

RF Package for the high power transistor is low cost, good thermal performance in RF application.
A variety of package options are available.

High Frequency PKG

Specifically designed for high frequency or high data rate performance.Ceramic feedthroughs with low
electrical-resistance and heat sinks with high thermal conductivity are available for high power devices.

STRUCTURE
HEAT SINKTYPE
HEAT SINK TYPE THERMAL CONDUCTIVITY(W/mK)
W-Cu 180~230
Mo-Cu 170~270
CMC 200~290
CPC(141/111/212) 270~300
SUPR-CMC 290~360
Cu 390
AI Diamond 500
CERAMIC
ALUMINA CONTENT 90~96%
DIELECTRIC CONSTANT
(@1MHz)
9 MIN
CTE(10-6/℃ ) 7.2 MAX
THERMAL CONDUCTI
VITY(W/mK)
15 MIN
CONDUCTOR(Pattern)
MATERIAL
W,Mo-Mn
LEAD PIN
MATERIAL KOVAR OR ALLOY42
THICKNESS(mm) 0.1~0.2
HEAT SINKTYPE
NI Electroplated sulfamate Nickel; 2-7um
AU Electroplated matt gold; 0.5-2.5um
Application Wire Bondable,Solderable,
Die attachable

개인정보취급방침

이메일주소무단수집거부

SITEMAP