Metallife Inc. provides many different kinds of sub components for both inside
and outside of packages using W-Cu or Mo-Cu plate which has a good thermal
performance.

The major products include substrates, heatsinks (carrier, block and optical bench), Kovar components, laser pallets, metal & ceramic lids, Z-sleeve and ferrules. We provide the plated products at the request of
customers in appropriate ways.

SUBSTRATE

Avariety of substrates for BTF PKG are available with low cost High thermal conductive material can be used (W-Cu / Mo-Cu / Cu-Mo-Cu dad / Cu...)

  • High thermal conductiviy(170~300 W/K)
  • Wire bondable / laser weldable / solderable
  • Controlled CTE
  • Mi / Au Plating to meet MIL-STD
  • Can be attached with patterned ceramics(Al2O2 / AIN)
HEAT SINK & CARRIER
  • High thermal conductivity(170~250 W/K)
  • W-10~25%Cu / Mo-Cu / Cu-Mo-Cu / Cu
  • Precise machining
  • Controlled CTE
  • Ni / Au Plating to meet MIL-STD
  • Flatness : under 20um
KOVAR COMPONENTS
  • Lid, Ferrule
  • Kovar or Alloy42 material
  • Precise manufacturing process
  • Reliable Finishing(Soft Au)
  • Low C.T.E
  • Soldering available

MULTILAYER CERAMICS HTCC (High Temperature Co-fired Ceramic)

HOUSING MATERIAL

Metallife Inc. Unique Characteristics of Multilayer Co-Fired and Post-Fired Ceramic technologies can provide a wide
variety of solutions.
Excellent Design Flexibility (3D Structure, High Density Design rule)
Excellent Material Properties (Physical & Mechanical, Thermal)
Metal Parts Brazing Capability (Heat Sinks / Seal Rings / Leads, Reliable High Temp Brazing)
Make it Reliable - Make it Hermetic !

APPLICATION
  • Optical Communications PKG (TOSA / ROSA, BTF, TO)
  • RF Power TR & High Frequency PKG
  • Various Sensor Package
  • MEMS, SMD Package
  • Hybrid IC with mixed Power circuit
  • Ceramic Heater
SPECIFICATION
TEM UNIT HTCC
WHITE BLACK
Material name - MHA-94 MBA-92
Dielectric Constant @1MHz / 10GHz 9.4 / 8.8 9.8 / 9.2
Dielectric loss tangent(Tan ∂) @1MHz / 10GHz 5x10-4 / 1x10-4 3x10-4 / 1x10-4
Termal conductivity W/mK 18 17
TCE ppm/℃ 7.5 7.5
Density g/㎠ 3.6 3.6
Flexural strangth MPa >350 >350
Conductor Materials - W, Mo W, Mo
Volume Resistivity Ω.cm >1012 >1012
Alumina contents % 92~96 92
DESIGN RULES FOR HTCC (EXPOSED SURFACE LAYER)
LOCATAIN SPEC.
a Via Hole Diameter ≥150
b Via Hole Land ≥400
c Via Hole Pitch ≥650
d Via Catch Pad to Line
- w/Via from Upper layer
- w/o Via from Upper layer
≥300
≥200
e Via Chtch Pad to Substrate Edge ≥650
f Via Catch Pad to Cavity Edge ≥650
g Line Width ≥150
h Line Spacing ≥100
i Line to Substrate Edge ≥500
j Line to Cavity Edge ≥500
k Castellation to Line ≥250
l Castellation to Via Catch Pad ≥300

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